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Company Info
Company Name : More super hard company
Business Type : grinding wheel,abrasive tools,cutting tools
Company Address : B906，Wanda Plaza,Zhongyuan Road，Zhengzhou,Henan,China
Postal Code : sales
Contact Person : Anna wang
Mobile Phone : 86-15617785923
Tel : 86-371-86545906
Fax : 86-371-86545906
WebSite : www.moresuperhard.com
Description :
Diamond dicing blade is used for grooving ,cutting silicon, compound semiconductors, glass and other materials in electronic information industry.
The Type: diamond hub dicing blade and diamond hubless dicing blade
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Electroformed dicing blade |
Features: Easy to handle ultra-thin blade; Blade dicing after laser grooving; Variety of different grit concentrations; Shows stable processing performance in high load processing |
Hub dicing blade |
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Application: Silicon wafers, compound semiconductor wafers (GaAs, Gap),oxide wafers (LiTaO3) |
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resin dicing blade |
Features: High processing quality for cutting of hard, brittle materiais; Able to precisely control diamond concentration to achieve cutting quality; Improved cut quality on hard materials |
Hubless dicing blade |
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Application: Glass, Crystal, Quart, LiTaO3, Ceramics, Optical, QFN, splitter |
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metal dicing balde |
Features: High rigidityminimized wavy and slant cutti g ; Able to control diamond concentration to achieve cutting quality ;Excellent rigidit and cut quality |
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Application: Electronic parts, Optical devices, semiconductor packages, BGA, CSP, |
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Electroformed dicing balde |
Features: Wide selection of blade options; Proprietary thin-blade technology ;Blade thickness - 0.0 15 mm to 0.3 mm; Available for both dicing saws and slicers |
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Application: Various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon |
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Other specification can be produced according to customer’s requirements |
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