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Company Info

Company Name : More super hard company

Business Type : grinding wheel,abrasive tools,cutting tools

Company Address : B906,Wanda Plaza,Zhongyuan Road,Zhengzhou,Henan,China

Postal Code : sales

Contact Person : Anna wang

Mobile Phone : 86-15617785923

Tel : 86-371-86545906

Fax : 86-371-86545906

WebSite :

Diamond Dicing Blade For Electronic Industry Manufacture
Diamond Dicing Blade For Electronic Industry Manufacture
  • Diamond Dicing Blade For Electronic Industry Manufacture
  • Diamond Dicing Blade For Electronic Industry Manufacture

  • Price: USD1-2 / piece
  • origin : China
  • Keyword: ,

Cutting and Grinding Tool

Min supply : 1

Stock number : 1000

Description :

Diamond Dicing Blades

diamond dicing blades

Diamond dicing blade is used for grooving ,cutting silicon, compound semiconductors, glass and other materials in electronic information industry.

The Type: diamond hub dicing blade and diamond hubless dicing blade

Electroformed diamond hub dicing blade

Electroformed dicing 



Easy to handle ultra-thin blade; Blade dicing

after laser grooving; Variety of different grit 

concentrations; Shows stable processing 

performance in high load processing

Hub dicing blade

Application:  Silicon wafers, compound semiconductor wafers (GaAs, Gap),oxide wafers (LiTaO3)


resin dicing blade

   resin dicing blade


High processing quality for cutting of hard, brittle materiais; Able to precisely control diamond concentration to achieve cutting quality; Improved cut quality on hard materials 


Hubless dicing 



Glass, Crystal, Quart, LiTaO3, Ceramics, Optical, QFN, splitter 

 metal dicing blade


   metal dicing balde


High rigidityminimized wavy and slant cutti

g ; Able to control diamond concentration to 

achieve cutting quality ;Excellent rigidit and 

cut quality

Application:  Electronic parts, Optical devices, semiconductor packages, BGA, CSP, 

Electroformed dicing balde

Electroformed dicing 



Wide selection of blade optionsProprietary 

thin-blade technology ;Blade thickness - 0.0

15 mm to 0.3 mm; Available for both dicing

saws and slicers

Application:  Various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon 

Other specification can be produced according to customers requirements   

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